Combine the techonology of Al-extrusion and Cu-insert, totally use the feature of pure Cu's high-efficiency thermal absorption ability and Al's quick thermal conduction ability to conduct heat to sunflower Fins rapidly and uniformly, the wind go out in four sides and can at least increase 30% more thermal conduction area than normal sunflower and improve the cooling efficiency greatly. Comparing with the water-cooling, pure pepper and heatpipe, it owns more market value.

Particular

　-> Used for AMD K8 89W Solution
　-> High multiple proportions Al-Extrusion technology and have super large
　　 heat emission area in definded volunme
　-> Square sunflower heatsink,the wind go out from four sides and can at
　　 least increase 30% more thermal conduction area than normal sunflower.
　-> AVC patent Cu-insert technology.
　-> The high efficiency fan that AVC designs and manufactures itself
　-> AMD convenient one-hole clips

Spec